服務背景
IC作為重要的車載元器件部件,是AEC委員會持續關注的重點領域。AEC-Q100對IC的可靠性測試可細分為加速環境應力可靠性、加速壽命模擬可靠性、封裝可靠性、晶圓制程可靠性、電學參數驗證、缺陷篩查、包裝完整性試驗,且需要根據器件所能承受的溫度等級選擇測試條件。需要注意的是,第三方難以獨立完成AEC-Q100的驗證,需要晶圓供應商、封測廠配合完成,這更加考驗對認證試驗的整體把控能力。廣電計量將根據客戶的要求,依據標準對客戶的IC進行評估,出具合理的認證方案,從而助力IC的可靠性認證。
測試周期
測試項目
序號 | 測試項目 | 縮寫 | 樣品數/批 | 批數 | 測試方法 |
A組 加速環境應力試驗 | |||||
A1 | Preconditioning | PC | 77 | 3 | J-STD-020、 |
JESD22-A113 | |||||
A2 | Temperature-Humidity-Bias | THB | 77 | 3 | JESD22-A101 |
Biased HAST | HAST | JESD22-A110 | |||
A3 | Autoclave | AC | 77 | 3 | JESD22-A102 |
Unbiased HAST | UHST | JESD22-A118 | |||
Temperature-Humidity (without Bias) | TH | JESD22-A101 | |||
A4 | Temperature Cycling | TC | 77 | 3 | JESD22-A104、Appendix 3 |
A5 | Power Temperature Cycling | PTC | 45 | 1 | JESD22-A105 |
A6 | High Temperature Storage Life | HSTL | 45 | 1 | JESD22-A103 |
B組 加速壽命模擬試驗 | |||||
B1 | High Temperature Operating Life | HTOL | 77 | 3 | JESD22-A108 |
B2 | Early Life Failure Rate | ELFR | 800 | 3 | AEC-Q100-008 |
B3 | NVM Endurance, Data Retention, and Operational Life | EDR | 77 | 3 | AEC-Q100-005 |
C組 封裝完整性測試 | |||||
C1 | Wire Bond Shear | WBS | 最少5個器件中的30根鍵合線 | AEC-Q100-001、AEC-Q003 | |
C2 | Wire Bond Pull | WBP | MIL-STD883 method 2011、 | ||
AEC-Q003 | |||||
C3 | Solderability | SD | 15 | 1 | JESD22-B102或 J-STD-002D |
C4 | Physical Dimensions | PD | 10 | 3 | JESD22-B100、 JESD22-B108 |
AEC-Q003 | |||||
C5 | Solder Ball Shear | SBS | 至少10個器件的5個鍵合球 | 3 | AEC-Q100-010、 |
AEC-Q003 | |||||
C6 | Lead Integrity | LI | 至少5個器件的10根引線 | 1 | JESD22-B105 |
D組 晶圓制造可靠性測試 | |||||
D1 | Electromigration | EM | / | / | / |
D2 | Time Dependent Dielectric Breakdown | TDDB | / | / | / |
D3 | Hot Carrier Injection | HCI | / | / | / |
D4 | Negative Bias Temperature Instability | NBTI | / | / | / |
D5 | Stress Migration | SM | / | / | / |
E組 電學驗證測試 | |||||
E1 | Pre- and Post-Stress Function/Parameter | TEST | 所有要求做電學測試的應力試驗的全部樣品 | 供應商或用戶規格 | |
E2 | Electrostatic Discharge Human Body Model | HBM | 參考測試規范 | 1 | AEC-Q100-002 |
E3 | Electrostatic Discharge Charged Device Model | CDM | 參考測試規范 | 1 | AEC-Q100-011 |
E4 | Latch-Up | LU | 6 | 1 | AEC-Q100-004 |
E5 | Electrical Distributions | ED | 30 | 3 | AEC Q100-009 |
AEC Q003 | |||||
E6 | Fault Grading | FG | - | - | AEC-Q100-007 |
E7 | Characterization | CHAR | - | - | AEC-Q003 |
E9 | Electromagnetic Compatibility | EMC | 1 | 1 | SAE J1752/3-輻射 |
E10 | Short Circuit Characterization | SC | 10 | 3 | AEC-Q100-012 |
E11 | Soft Error Rate | SER | 3 | 1 | JEDEC |
無加速:JESD89-1 | |||||
加速:JESD89-2或JESD89-3 | |||||
E12 | Lead (Pb) Free | LF | 參考測試規范 | 參考測試規范 | AEC-Q005 |
F組 缺陷篩選測試 | |||||
F1 | Process Average Testing | PAT | / | / | AEC-Q001 |
F2 | Statistical Bin/Yield Analysis | SBA | / | / | AEC-Q002 |
G組 密封封裝完整性測試 | |||||
G1 | Mechanical Shock | MS | 15 | 1 | JESD22-B104 |
G2 | Variable Frequency Vibration | VFV | 15 | 1 | JESD22-B103 |
G3 | Constant Acceleration | CA | 15 | 1 | MIL-STD883 Method 2001 |
G4 | Gross/Fine Leak | GFL | 15 | 1 | MIL-STD883 Method 1014 |
G5 | Package Drop | DROP | 5 | 1 | / |
G6 | Lid Torque | LT | 5 | 1 | MIL-STD883 Method 2024 |
G7 | Die Shear | DS | 5 | 1 | MIL-STD883 Method 2019 |
G8 | Internal Water Vapor | IWV | 5 | 1 | MIL-STD883 Method 1018 |